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Thermal analysis of bulk filled composite resin polymerization using various light curing modes according to the curing depth and approximation to the cavity wall

机译：根据固化深度和腔壁的近似，使用各种光固化模式的大块填充复合树脂聚合的热分析

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Hoon-Sang Chang; Kyu-Jeong Cho; Su-Jung Park; Bin-Na Lee; Yun-Chan Hwang; Won-Mann Oh; In-Nam Hwang;
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1. Thermal analysis of bulk filled composite resin polymerization using various light curing modes according to the curing depth and approximation to the cavity wall [J] . Chang Hoon-Sang, Cho Kyu-Jeong, Park Su-Jung, Journal of Applied Oral Science . 2013,第4期

机译：根据固化深度和与腔壁的近似关系，使用各种光固化模式对本体填充的复合树脂聚合进行热分析
2. Effect of light-curing time on light-cure/post-cure volumetric polymerization shrinkage and regional ultimate tensile strength at different depths of bulk-fill resin composites [J] . Kurumi IDE, Masatoshi NAKAJIMA, Juri HAYASHI, Dental Materials Journal . 2019,第4期

机译：光固化时间对填充树脂复合材料不同深度下光固化/固化后体积聚合收缩率和区域极限抗拉强度的影响
3. Polymerization Shrinkage and Depth of Cure of Bulk-Fill Resin Composites and Highly Filled Flowable Resin [J] . Jang J-H, Park S-H, Hwang I-N Operative dentistry . 2015,第2期

机译：填充树脂和高填充流动性树脂的聚合收缩率和固化深度
4. MATERIAL STATE MODELING DURING COMBINED RAMP AND ISOTHERMAL CURE CYCLES FOR POLYMER COMPOSITES USING SHEAR RHEOMETRY AND THERMAL ANALYSIS [C] . S. Alavi-Soltani, A. Mousavi, S. Sabzevari, International Baltimore SAMPE Symposium and Exhibition . 2009

机译：使用剪切流变测压和热分析在聚合物复合材料中组合斜坡和等温固化循环期间的材料状态模型
5. A comparison of gingival marginal adaptation and surface microhardness of Class II resin based composites (conventional and bulk fill) placed in layering versus bulk fill techniques. [D] . Abouelnaga, Mohamed Ahmed Anis. 2014

机译：比较了放置在分层与整体填充技术中的II类树脂基复合材料（常规填充和整体填充）的牙龈边缘适应性和表面显微硬度。
6. Thermal analysis of bulk filled composite resin polymerization usingvarious light curing modes according to the curing depth and approximation to thecavity wall [O] . Hoon-Sang CHANG, Kyu-Jeong CHO, Su-Jung PARK, 1928

机译：本体填充复合树脂聚合的热分析。根据固化深度及其近似值，可以选择各种光固化模式中空墙
7. Depth of cure of high-viscosity bulk-fill and conventional resin composites using varying irradiance exposures with a light-emitting diode curing unit [O] . Jennifer A. Hasslen, Wayne W. Barkmeier, Raymond S. Shaddy, 2019

机译：使用具有发光二极管固化单元的不同辐照度暴露的高粘度散装填充和常规树脂复合材料的深度

Thermal analysis of bulk filled composite resin polymerization using various light curing modes according to the curing depth and approximation to the cavity wall

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